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8.DURABILITY 耐久性
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8.1
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SLLDERING
TEST
可焊性試驗
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The tip of the terminals shall be
dipped 2mm in the solder bath at a
Temperature of 230±5℃ for 3±0.5sec.
端子頂部被浸入焊錫池2mm深,溫度230±5℃
時間3±0.5秒.
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A new uniform coating of solder Shall cover a minimum of 75% of the surface being immersed.
浸入的部分75%以上表面將被錫覆蓋。
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8.2
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RESISTANCE
TO
SOLDERING
HEAT TEST
耐焊性試驗
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Solder bath method
Solder temperature 230±5℃
Immersion time 3±0.5scc
Immersion depth up to the surface of
the board
Thickness of PCB 1.6 mm.
焊爐焊的溫度控制在230±5℃，過爐焊接的時間3±0.5秒，于(蒸板)厚度為1.6 mm.
Solder bath method
Bit temperature 300±10℃
application time 3±0.5scc
however excessive pressure shall not be applied to the terminal.
手焊接的時候溫度需控制在300±10℃，時間為
3±0.5秒，但不能在排腳上施加異常壓力。
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Without deformation of case
Or excessive looseness of
mechanically electrical characteristics
Shall be satisfied.
本體無變形，能滿足于機械、電器性能。
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8.3
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LIFI TEST
壽命試驗
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10000cycles of operation at a rate
of 15-18 cycles per minute with unloading.
無負載條件下,每分鐘15-18次的速度操作10000次.
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(1)Contact resistance接觸阻抗.
100mΩ max.100毫歐以下.
(2)Operating force動作力. ±30%Inltial value.
變化范圍初始值±30%.
(3)ITEN 項目—6.2
(4)ITEN 項目—6.3
(5)ITEN 項目—7.2
(6)ITEN 項目—7.3
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8.4
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HEAT TEST
耐熱試驗
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80±2℃ for 96 hours , caner test keep
in normal condition for 30minutes.
在80±2℃環(huán)境中放96小時,再放在正常環(huán)境中
30分鐘后進行測試.
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(1)Contact resistance 150mΩ max.
接觸電阻150毫歐以下.
(2)Insulation resistance
絕緣電阻.
50MΩmin 50兆歐以上.
(3)There shall be no sign of damage mechanically and electrically.
無任何跡象顯示機械及電器性能之損壞.
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8.5
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HUMIDITY TEST
耐濕試驗
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40±2℃ 90-95%RH for 96firs after test
keep in mortal condition for 30 min.
在40±2℃ 90-95%RH環(huán)境中放96小時,再放在正常環(huán)境中,30分鐘后進行測試.
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8.6
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COLD TEST
耐冷試驗
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At -20±3℃ for 96hours,after test
kept in normal condition for 30 min.
在-20±3℃ 環(huán)境中放96小時,再置于正常環(huán)境中,30分鐘后進行測試.
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